High Technology PCB

High Technology PCBs/Complex PCBs

We can produce all kinds of complicated PCB, including Rigid PCB(1-50 layers), Flex PCB(2-10 layers), Rigid-Flex( 36/10 layers ),HDI, High TG, High-Frequency PCB(Rogers,Arlon,Taconic,Nelco, etc.),Halogen free board thickness 0.2-8.0mm with surface finish: HASL, ENIG, ENEPIG, Immersion Silver, OSP, gold finger, hard gold, soft gold etc.

We also have a range of features available for your custom printed circuit board such as impedance control, gold fingers, blind/buried microvias, peelable solder mask, jump V-scoring, castellated holes, countersinks/counterbores, etc.

Features Capability
Layer 1-50 layer(FR4), 1-4 layer(Aluminum), 2-10 layer(Flex), 36/10 layer(Rigid-Flex)
Material

FR4 standard Tg 130C
FR4 medium Tg 150C
FR4 high Tg 170C
FR4 high Tg 180
Aluminum 1.0W/MK-3.0W/MK
High Frequency
PFTE
FPC
Thick Copper
BT Base
Pi Base
Rogers
Arlon
Taconic
Nelco

Board Thickness .0079"-.315"(0.2mm-8.0mm)
Copper Thickness 0.5oz-12oz
Inner layer Copper Thickness 0.5oz-6oz
Board size 1200x700mm
Min Tracing/Spacing 3.0mil/3.0mil
Min Annular Ring 3mil
Min drilling Hole diameter 0.2mm(8mil), 0.1mm(4mil)-laser drill
Solder Mask Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue
Silkscreen color White, Blue, Black, Red, Yellow
Surface finish

HASL -Hot Air Solder Leveling 
Lead Free HASL - RoHS 
ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 1-4 u") 
Immersion Silver - RoHS 
Immersion Tin - RoHS 
Flash Gold
Hard Gold
Soft Gold
Gold finger
OSP - Organic Solderability Preservatives - RoHS ENIG+OSP
ENIG+G/F
Flash Gold+G/F
Immersion Silver+G/F
Immersion Tin+G/F

Surface/Hole plating thickness 20-30um
Board thickness tolerance +/-0.1mm ~ +/-10%
Board size tolerance +/-0.1mm~+/-0.2mm
Impedance tolerance +/-5%~+/-10%
BGA Pitch 0.2mm(8mil)
Aspect Ratio(hole size: board thickness) 1:40
Chamfer of Gold Fingers 20, 30, 45, 60
Test 10V-250V, flying probe or testing fixture
Others Techniques Gold fingers 
Blind/Buried hole 
peelable solder mask 
Edge plating 
Carbon Mask 
Kapton tape 
Countersink/counterbore hole 
Press fit hole 
Via tented/covered with resin 
Via plugged/filled with resin 
Via in pad
Special Board/Progress Aluminum substrate&copper substrate
Heatsink
Sweat bonding
Ceramics(DBC)
Metal-Buried PCB
Embedded Resistance/Embedded Capacitance
RF hybrid lamination
Microvia copper fill
Resin fill