Flex/Flex-Rigid PCB

Flex/Flex-Rigid PCB

We works with thousands of high-technology companies and organizations from around the world. Some markets served includes Automotive, Medical, Industrial, Aerospace, Military, and Telecommunications.

Flex PCB

Flexible printed circuit boards combine conductive polymer with a flexible dielectric film, while flex-rigid PCBs consist of conductive polyimide and FR4 material. The fully flexible nature of the boards entails that they can be bent, folded or twisted to fit devices in a way no other printed circuit boards can, meaning that users no longer need to design and build bespoke technologies to fit the circuit board. What's more, the materials employed to manufacture flexible PCBs are lightweight. Flex PCBs are generally used in medical devices, industrial equipment, and telecommunications.

Rigid-Flex PCB

Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

   
Material:  FR4, Tg: 130℃/170℃,Rogers,Arlon,Taconic
Bergquist, Thermagon
Stiffener Material: Polyimide, FR4, SUS
Flex Circuits: 1-10 Layers
Rigid-flex Circuits: 2-36 Layers
Standard Panel Size: 250mm*400mm
Line Width and Spacing: 3mil/3mil
Min. Board Thickness: Single:0.1mm
2 layers:0.2mm~6.0mm
4 layers:0.4mm~8.0mm
6 layers:0.8mm~8.0mm
8 layers:1.0mm~8.0mm
10 layers:1.2mm~8.0mm
12 layers:1.5mm-8.0mm
14 layers:1.5mm-8.0mm
16 layers:1.6mm-8.0mm
18 layers:2.2mm-8.0mm
20 layers:2.4mm-8.0mm
Min. Hole Size: Drill Hole: 0.15mm
Aspect Ratio: 20:1
Base Copper: 1/3OZ -- 2OZ
Size Tolerance: Conductor Width:±10%
Hole Size: ±0.05mm
Hole Registration: ±0.050mm
Outline Tolerance:±0.075mm
Surface Treatment: ENIG: 0.025um - 3um
OSP:
Immersion Tin: 0.04-1.5um
Dielectric Strength: AC500V
Solder Float: 288℃/10s
Peeling Strength: 1.0kgf/cm
Flammability: 94V-O